Krystaic is a semiconductor company serving the global semiconductor packaging, testing and manufacturing services. For a long time, we have insisted on technological innovation, focusing on the research and development of advanced semiconductor process technology and the assembly of end products.

We produce SSD, BGA132, TF, UDP and other products, which can meet the packaging and assembly needs of customers of various types for particles.

Our current monthly packaging capacity can reach 6KK (million) and module can reach 3 to 4KK, which can meet the needs of customers with different purchasing volume.

Our professional sales and R&D team will provide you with reasonable solutions.

Micro SD Card

Micro SD card is a new generation of memory devices based on semiconductor flash memory, due to the small size, fast data transfer speed, hot-swappable and other excellent features.

It is widely used in portable devices such as electronic dictionaries, cell phones, digital cameras and car navigation systems.

eMMC

EMMC has entered the market in a short period of time with a concise and advanced design, which uses a high-performance host chip and a stable NAND Flash chip to enable more and faster multitasking in a more stable manner while improving data transfer efficiency, that ensures smooth web browsing, downloading applications, HD video playback, and running large games.

A distinct advantage of eMMC is the integration of a controller in the package that provides a standard interface and manages the flash memory, allowing device manufacturers to focus on other parts of product development and shorten the time to market.

BGA132

BGA package flash memory, where BGA is the abbreviation of "Ball Grid Array", that is, ball grid array packaging technology, which is the use of ball grid array contact communication. The contact is located at the bottom of the chip. The number of common contacts are 132 or 152. The SMT is soldered by the controlled collapse chip method, which improves its electrical and thermal properties, and the assembly can be co-planar soldered, making it much more reliable. 

For future PCIE 4.0 SSDs, higher transfer rates can only be achieved with BGA packages. In the future, all flash memory in BGA packages will be used in both the consumer and enterprise sectors, instead of TSOP package.