What is the Bond Test Process? | from Oricus Semicon Solutions.
The Bond Test Process from Oricus Semicon Solutions specifies a cutting-edge technology process and a series of processes for determining the precise conditions under which a semiconductor chip must be positioned within a die if it is to work as intended by the original design.
Introduction:-A Bond Test Process is performed to determine the strength of an adhesive to hold together two materials while being stressed. After the bond has been applied, it is tested the strength of the bond by exerting force on the adhesive in an attempt to detach it from the material.
Purpose of Bond Test Process:-The overall bonding of a material may be thought of as its bond strength, which is determined by the sort of stress applied to the bond and the temperature at which the test is conducted. The direction of the force applied to the bond will also affect its strength.
There are various types of Bond Testing in the semiconductor industry which are following:-
1) Wire Pull Test
2) Die Share Test
3) Ball Shear Test
4) Wedge Shear Test
5) Wedge Bond Wire Pull Test
The Bond Test equipment such as Nordson Dage 4600 Bond Tester, Stellar 4000 Bond Tester, Dage PC 2400 Bond Tester, and Hook-pull Test gauge.
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