What‌ ‌is‌ ‌the‌ ‌Wire‌ ‌Bond‌ ‌Process?‌ ‌

Wire bonding is the process of using tiny wires composed of materials like gold and aluminium to create electrical links between semiconductors (or other integrated circuits) and silicon chips. Gold ball bonding and aluminium wedge bonding are the two most frequent methods.

During semiconductor device manufacture, wire bonding is a process for making electrical connections between a silicon chip and the external leads of a semiconductor device using very fine bonding wire. Copper (Cu), Gold (Au), and Aluminum (Al) are used to make these wires (Al).

ASM AB339 Eagle, ASM Eagle 60 Wire Bonder, ASM Eagle 589 Wire Bonder, MDB-2575 Manual Wedge Wire Bonder, and different valuable Wire Bonding instruments such as Capillary and Wire Clamps are employed.

There are various Wire Bond methods which are as follows:

1) Thermocompression Bonding

2) Ultrasonic Bonding

3) Thermosonic Bonding

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